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Multilayer PCBs are built by joining all the number of layers and materials at high temperature and pressure so as to remove any trapped air between the layers. Resin and adhesive material is used to stick the components and different layers together. You can choose from a number of materials such as exotic ceramic, epoxy glass, or Teflon etc. to build your PCB. The different prepreg and core layers are combined and go through the lamination process taking place at high temperature and pressure that helps to melt the layers together. After that the PCB is cooled down to form a hard and solid board.

Before jumping to the construction of multilayer PCB, you must know about Vias and their work. Let us briefly introduce these terms to you here. Vias exist in three main types, i.e., buried, blind, and through vias.

Buried vias are concealed within PCB layers, and you can never see them from the outside. They make connections between internal layers that, through vias, cannot reach. On the contrary, blind vias do not travel through the whole circuit board. They only make connections between outside and internal layers.

Knowing the usage of these three types of vias is the key to effectively design a multilayer PCB. They will make PCB routing amazingly simpler. However, if you are worried about cost, you should use buried and blind vias when it is an ultimate necessity.

There are a number of factors you have to keep in mind while building your Multilayer PCBs. For example, signal integrity and power integrity etc. Copper traces on the PCB allow current to flow through but also has resistance which can, in some cases, alter the current or quality of current which will affect the overall performance of the board. This is why controlled impedance traces are required. The copper thickness should be increased than normal value because these traces can exceed in temperature. In order to control the temperature, the width of the traces is increased accordingly.

How to identify multilayer PCB?

In order to identify the individual layers on a Multilayer PCB you should keep a few things in mind. For example, using a bright light to see the copper planes will let you see the traces more clearly and will help you to analyze the inner layers. You can easily identify the inner layers when there are no lines or paths crossing your line of vision. In some PCBs the total number of layers is imprinted onto the edges.

If you want to know the total number of layers laminated in the multilayer PCB in your hand, we can help you with that. Simple, follow the following steps:

Shine a light on the board edge to see the copper planes. You will be able to see signal traces more thoroughly. Use bright light to examine the inner layers of the multilayer PCB. The best area to look for inner layers is where you cannot see paths or lines on the outer layer. You can also look around the edge to read the number of layers. Some manufacturers print the total number of layers on the board.

PCBs are developing in the direction of smaller volume, lighter weight, and increased density with the continuous innovation of electronic technology and the continuous improvement of the requirements for electronic equipment in some industries such as computers, medical treatment, and aviation. Single and double-sided printed boards can no longer meet the demand, so it is necessary to consider using more layers and higher assembly density multilayer circuit boards.

Multilayer PCB circuit boards are currently the most widely used circuit board type. Multilayer PCB are circuit boards composed of two or more copper layers superimposed on each other. The most common is four 6-layer board, such as the familiar computers in our daily life. Single-layer and double-layer boards are easy to distinguish and can be distinguished with the naked eye. Except for the wiring on both sides, the rest of the place is transparent. But for multilayer PCB boards with four-layer boards and six-layer boards, if there is no corresponding mark on the board, it is not so easy to distinguish. Generally, the requirements for the structure design and process production of multilayer electric boards are very high, and the higher the number of layers, the more difficult it is, and it is suitable for use in more complex circuits.

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