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1.Plating Hole Defects Manufacturing Of PCB

Holes carry electricity from one side of the board to the other. Plating of the hole wall during manufacture. During this, By establishing the electrical conductivity from the top in the endplate portion depositing copper.

If the copper deposition is incorrect, it will create plating voids, leaving gaps in the wall with no copper coating. It could happen due to air bubbles, contamination in the holes, contaminated materials, and other similar reasons. You can prevent this from happening by following the manufacturer’s direction and cleaning the equipment as instructed.

2.Lack Of Solder Mask Between Pads

It is a common problem that accompanies PCB manufacturing at home or production PCB manufacturing. When one solder crosses one lead to the other and ends up with an abnormal connection with multiple traces, Can see this error. The error is small, therefore challenging to identify.

If these shorts go undetected, they can damage the complete assembly by burning up the components. One standard solution is adding a solder mask between pads, so there is no gap between the stencil and PCB.

We have to take this problem seriously. This problem is common and often happens. If not handled properly, it may lead to a short circuit or open circuit. Finding practical solutions can help you save time and material costs. Make PCB faster.

3.Electromagnetic Compatibility Issues In Cheap PCB Manufacturing

Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) are two standard terms linked with the PCB manufacturing process. The former term is generally used to produce and transmit electromagnetic energy, whereas the latter one talks about the damaging effect of EMC. These issues arise because of possible design flaws and can be decreased simply by lowering the board’s ground area.

Reducing the contact area of the circuit can effectively block the problem of electromagnetic compatibility. Another method, you can choose advanced PCB production; although the cost increases, the PCB supplier is production will be more refined and more effective to solve this problem.

4.Burned Circuit Defects In Cheap PCB Manufacturing

When the PCB passes high temperatures during the manufacturing process, circuits usually can get burned. If there is not enough space around the component, it will zoom in; the ingredients’ size and shape do not match the heat generated in the application, say for a 4-layer PCB manufacturing.

We have to avoid burning the circuit. It’s critical to ensure that components have adequate space around them to allow air to circulate any heat sinks, and components will be working within their operating capability.

In general, as long as the heat dissipation function is complete enough, we can avoid circuit burnout during PCB board work.

5.Chemical Leak Problem In Manufacturing Of PCB

The chemical fluid leakage can result from leftover trace elements that were not removed appropriately with care during the PCB manufacturing process.

Corrosion of PCB boards is also a very troublesome problem. Compared with the issue of PCB burnout, their appearance is different. But the result is the same, and it will also cause the PCB not to work properly.

To prevent this from happening, we must thoroughly clean the board, as the smallest residue can cause corrosion of the boards and trigger a short circuit. During the inspection process, it is vital to check for any chemical leakage and fluids left over.

6.The Problem Of Substrate Size In PCB Production

The dielectric constant needs to be small and stable for better transmission. If the substrate material is made for withstanding high frequency and speed, it should also have low hygroscopicity. Size stability and resistance to heat and chemical, and impact strength should also be excellent for selected substrate material.

The size of the PCB substrate can be changed for the following reasons:

·The release of the shearing effect causes the substrate to shrink in size.

·Tension causes the size of the base plate to change.

·The Multi-layer board lamination process results in dimensional changes.

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