In this passage, we are providing the details of 5 PCB assembly problems and how to solve the problems. If you are going to learn the knowledge please check and read the content below for more.
What is Plating Voids? – How to solve it?
Plated through holes are important holes on the printed circuit board, as they carry electricity from one side of the board to the other side through the holes. The walls of these holes are electroplated during the PCB fabrication process. Before electroplating, the circuit board is made conductive from the top to bottom by copper deposition.
In this process, the electroless copper is made to adhere to the edges of the circuit board and within the holes. The problems with copper deposition give rise to plating voids, which means the walls are not coated evenly with copper. These holes may affect the flow of electricity. Plating voids may be caused due to a variety of reasons such as material contamination, air bubbles in the material, contaminated holes, and so on. So, the defects caused due to air bubbles, contamination, and insufficient cleaning can be avoided by cleaning the material before drilling. Also, other defects can be avoided by following the directions provided by the manufacturer.
What is Physical Damage? – How to solve it?
Failure of PCB is linked to physical damage, which is caused due to environmental stresses or during the SMT manufacturing process. Most common cause of PCB failure is dropping a circuit board in a prototyping phase. The damage to the physical components or pieces is not easily visible, and they are not repairable either. Thus, there is no other option except replacing the PCB.
What is Component shift? – How to solve it?
The component shift means poor alignment of PCBs parts to their intended target. Components shifts are one of the most common manufacturing defects that PCB assemblers face. It mainly occurs during reflow as parts tend to shift and move on the molten hot solder. Some parts may end up misaligning themselves. It is because of tension that exists on the molten solder surface. Some other factors may also bring about a component shift.
They include bent leads, massive convection rates, rapid vibrations in the conveyer, poor solder placement, and lopsided heat sinks on the components. But on the bright side, there are several ways that manufacturers can use to do away with cases of component shift when manufacturing their PCBs. It’s advisable to ensure you maintain the right humidity. You should also ensure that you have the proper temperatures too. Also, manufacturers need to ensure the minimization of movement.
What is Solder Joint? – How to solve it?
Most of the solder the electronic industry uses today is of the lead-free variety, as use of lead has been recognized as a health hazard. Lead-free solder melts at a higher temperature, and has introduced a variety of challenges. Rush PCB has compiled a list of solder defects that can help managers, designers, engineers, and operatives recognize these everyday problems and allow them troubleshoot efficiently and effectively.
The electronic industry uses the standard IPC 610D for the Acceptability of Electronic Assemblies. The standard offers criteria for lead-free soldering and has examples of typical process faults. The document is continually updated and will include more examples of lead-free soldering in the future.
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