What is plating Voids?
Plating Voids occur when there is a problem with the deposition on the board. Faults in sedimentary affect the structural integrity of the hole walls. It prevents the PCB from functioning correctly. Plating voids can form when there is an uneven coating of Copper. That may occur because of rough drilling, the presence of air bubbles, and contamination.
The best to avoid the formation of Plating Voids is to ensure that the drilling process is smooth. You can do this by following the manufacturer’s directions. That includes the speed of the drill and the recommended number of drill hits.
What problems can arise for not using DFM?
DFM or ‘Design for Manufacturability’ is an integral aspect of manufacturing PCBs. DFM analysis software can solve design problems before the manufacturing process. It also makes it easier to spot problems in the structure later on if it malfunctions. Without DFM software, it is hard to pinpoint the issues in a PCB. For one, then manufacturers and designers have to work off of intuition or guesswork.
To avoid similar problems, invest in some reputed DFM tools that are available on the market. It is bound to ease the manufacturing process and make it more efficient.
What is Inadequate Copper to edge clearance?
Copper is a common raw material for manufacturing PCBs. It is highly conductive; however, it is also soft and, therefore, prone to erosion. To prevent corrosion and isolate the Copper, we will cover some other materials instead. However, the problem arises when it is incredibly close to the edge. You will see that it’s trim when the PCB is trimmed. That leaves the Copper exposed and causes the PCB to malfunction.
The solution is simple; ensure that there is enough room between the layer of Copper and the edge of the circuit board. This way, it does not run the risk of getting trimmed along with the PCB. You can set specific clearance standards using DFM software as well.
What are the PCB Electronics Characteristics?
Initially, the through-hole technology was widespread in manufacturing PCB electronics. For this process, different electrical components got mounted in place using leads. It was done by embedding the edges through-holes that were present on the side of the board. On the other hand, you saw the components soldered up on copper traces to set them in place.
Surface mount technology first appeared in the 60s, but it started making a mark in the 80s. Nowadays, the surface mount is typically preferred for PCBs. It is far more convenient because now the electric components can be soldered directly on the surface of the board. That is because the parts have updated designs consisting of smaller ends caps and metal tabs.