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Electronic design automation software lets you know when a design margin is violated by stating the parameter that is out of the acceptable range. This is called a DRC error and it helps eliminate rework in the production stage.

DFM rules

DFM stands for design for manufacturing, which is the layout topology in a way that avoids all the problems that could be encountered during the PCB fabrication and assembly processes.

Drilling checks for drilling holes:

Drill-to-copper: The drill-to-copper is the land clearance between the edge of a drilled hole to the nearest copper feature. The nearest copper feature can be a copper trace, copper pour, or any other active copper region.

What is a Pad in PCB Design and Development?

Annular ring checks: To achieve acceptance for Class 2 and Class 3, follow the tables below published by Altium. The first one gives the annular ring requirements for mechanically drilled blind, buried, and through-holes on ½ oz copper:

What is DRC and LVS check?

A DRC allows one to verify the schematic and layout with regard to the margin of error you can incorporate in your design. As it allows one to check if a specific board layout correlates with the original circuit diagram or schematic of the design, it is also called layout versus schematic (LVS) check.

What are DRC errors?

Electronic design automation software lets you know when a design margin is violated by stating the parameter that is out of the acceptable range. This is called a DRC error and it helps eliminate rework in the production stage.

DFM rules

DFM stands for design for manufacturing, which is the layout topology in a way that avoids all the problems that could be encountered during the PCB fabrication and assembly processes.

Drilling checks for drilling holes:

Drill-to-copper: The drill-to-copper is the land clearance between the edge of a drilled hole to the nearest copper feature. The nearest copper feature can be a copper trace, copper pour, or any other active copper region.

Annular ring checks: To achieve acceptance for Class 2 and Class 3, follow the tables below published by Altium. The first one gives the annular ring requirements for mechanically drilled blind, buried, and through-holes on ½ oz copper:

Signal checks: The first checklist we like to implement after receiving Gerber files is signal checks. This checklist holds key parameters that include conductor width, spacing requirements, hole registration, and many more.

Solder mask checks: Coming to solder mask clearance, we can typically define it as a general isolation recommendation alongside specific details characterized by the kind of surface element(s) being isolated. Particular specifications apply to pads, which may be solder mask defined or non-solder mask defined, and drill holes, which may be plate through-holes or non-plated through-holes.

Silkscreen checks: Silkscreen to mask spacing, silkscreen to copper spacing, and silkscreen to hole spacing and route spacing

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