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A blind via links the surface layers of the PCB to the internal layers. Another point to note is that blind vias do not pass through the whole board. The surface layer is usually one and is either the upper or lower part of the board. Contrary, the internal layers can be more than one. That is why you can only see blind vias on one part of aboard.

In this passage you will learn the main elements of blind via PCB, come and check our content below for more information.

What are the types of blind via?

Photo-Defined Blind Via PCB

You can make a photo-defined blind by coating a photo-reactive resin sheet to a core. The core should consist of laminated traces enriched with planes and submerged signal layers. Remember to cover your photo-reactive sheet with patterns that shield the points where you will make the holes. You should also expose the sheet to wavelength rays to harden the residues on the board.  After that, immerse your circuit board in a dying mixture to eliminate any unwanted substance from the holes.

Sequential Lamination Blind Via

You can make this type of blind vias by passing a thin laminate piece through the two-faced PCB process. First, you need to drill, coat, and sketch the laminate to outline the characteristics that will make your PCB’s second layer. Leave the solid copper material on the other PCB part to act as your board’s first layer. It would be best if you also laminated your subassembly with the different board layers. Finally, pass your product through the process of making the surface layers of a multilayer board.

Controlled Depth Drilled Vias

As illustrated in figure 1, you can make controlled-depth vias using the through-hole via approach. However, you should set your drill to pierce only halfway through the board. You also need to place a pad on the second layer so that the drill penetrates it. Besides, it would help if you were cautious to ensure there are components underneath the percolated hole, forming contact with it. Lastly, you need to coat copper in the percolated hole concurrently with plating copper in the through-hole blind vias.

Laser Drilled Blind Vias

You can create these vias after laminating all your board layers; you can create these vias before designing and coating the surface layer. Use a laser to remove the copper on the surface layer and the insulating substance between the first and second layers. Remember, you can either use the CO2 or Excimer laser.

What are the applications of blind via?

This part will take a closer look at the two primary uses of blind vias in circuit boards. It is essential to realize that you can minimize your circuit board layers by expanding the ball-grid getaway channel. You can achieve that by creating blind vias.

Are you experiencing difficulties when penetrating through-hole vias for designing and trace breakout of BGA? If so, try increasing the getaway channels on the internal and lower layers with blind vias. Alternatively, you can use blind vias to reduce your circuit board aspect ratio.

Mostly, circuit board BGA components come with various pitches. For example, a 4.00mm radius board contains 0.8mm and 1.27mm pitch BGAs. Remember, the smallest size via hole is determined by both the drill and board aspect ratios.

How to make blind via PCB?

Circuit boards with blind vias use the necessary procedure of creating multilayer boards up to the drilling step. As mentioned earlier, blind vias provide more holes that facilitate connections between two layers for two-layered boards. Choose your build-up and contact your manufacturer before you start the circuit board design process.

It is important to note that you may encounter problems if you try adding vias ‘on the go.’ Mostly, you will run short of space, and most probably, you may abandon the PCB and start creating afresh. That is a waste of your precious time and resources. Therefore, follow the steps below keenly to avoid making mistakes.

But before that, let us look at the rules of blind vias:

  • Blind vias start from either the upper or lower layers of the board.
  • It would help if you placed them on the layers evenly.
  • Blind vias should not percolate the entire PCB.
  • They should not start or end in the middle of the board substrate.

The hole height and hole diameter (H/d) value should be less than one. Actually, 0.8 is the best value. That means you should assign big diameters to deep vias. Furthermore, huge vias also require significant dielectric gaps. To accurately create a blind via, you need to drill the vias within the central cores. Afterward, let the vias reach the outside layers.

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