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You can find suitable material in one of the following:

Fluorine-series resin – materials like PTFE have excellent dielectric performance and can be a great choice if you need at least 5GHz

frequency. Their cost is probably the highest of all three types, and they have a high thermal expansion coefficient. However, they perform impressively in areas of dielectric loss and constant and absorbing water.

PPO or PPE resin – a suitable option for 1-10GHz frequencies. They secure an all-around decent performance of your board.

Modified epoxy resin – they can also be the right choice for frequencies between 1GHz and 10GHz. In general, they have the most affordable cost, which is the reason for their popularity.

For example, we will consider PTFE, which falls into the fluorine-series category. It has excellent dielectric performance and can be a great choice if you need at least a 5GHz frequency. Please note that signal loss may also be due to the high roughness of the copper. It is why you should ensure to keep copper roughness under 1μm. Furthermore, it may be wise to go with roughness no bigger than 0.04μm.

We need to consider lamination material and its requirements if we are going to design HDI PCBs. Some considerations include dielectric performance, thermal capacity, insulation, and bonding. If you look at packages, the IC package may turn organic substrate from the ceramic. A decrease in the size of the FC package is noticeable as the values of S and L are around 15μm, with the tendency to become even more compact.

Multi-layered PCB substrate materials should reduce the thermal expansion coefficient and dielectric property while securing optimal resistance to heat. This type of substrate is the right choice as it can achieve all performance goals while maintaining an acceptable cost. We use SAP technology in the manufacturing process of circuits when their space and width are below 10μm. In fine circuit production on a large scale, MSPA can be applied to thin copper foil to insulate dielectric lamination.

How to choose PCB substrate materials?

You have the choice of picking from three different PCB types:

• Rigid

• Flexible

• Flex-rigid

The primary goal is to pick a board that will be perfect for your product. Many people aim for compact size and shape, but they forget about performance. Polyimide film can be a smart choice as it is versatile, and it can fit into different categories like black, white, and transparent. It also ensures a low thermal expansion coefficient while maintaining adequate resistance to heat.

Mylar substrate, on the other hand, is very elastic, and it has excellent resistance to environmental factors. On top of that, it is relatively affordable, which is why many users consider it. Flexible PCBs have to strive to achieve the same level of performance in terms of frequency and speed as standard PCBs. Advanced polyimide substrate and polytetrafluoroethylene are smart choices for flexible boards.

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